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| Hot Air Levelling Tape、High Temperature Masking |
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Base Material : Paper + PET
Adhesive : Silicone
Thickness : 0.25 mm
Adhesion : 1,500 gf/in
Feature : Heat resistant = 180 degC. Chemical resistant. Remove without leaving residue.
Application : Protect specific area of PCB for hot air levelling process.
Base Material : Crepe paper
Adhesive : Acrylic
Thickness : 0.14 mm
Adhesion : 300 gf/in
Feature : High temperature performance. Easy peel off after masking.
Application : For wave solder masking of printed circuit board.
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